Packaging electronics in the most efficient way to ensure that the system will operate to its full potential in a harsh environment is a serious challenge.
Interconnectivity of the sub systems and managing the thermal budget while securing structural integrity for the system are the key challenges. Our design and development process is a combination of design,
simulation and test practices to deliver products designed from the ground up for reliable operation in the extremes of temperature, shock and vibration.
With its extensive capabilities for thermal analysis, Tactical Systems can provide a completely engineered solution that optimizes size, power consumption, noise and vibration to extend longevity of products. Furthermore, extensive simulations also provide for what-if analysis, and proof of concept before the enclosure and associated electronics are ever fabricated.
Knowledge of diverse manufacturing processes and their constraints imposed on the design, rules for Design for Cost, assembly and producibility, coupled with the use of Finite Element Method for Linear and Non-Linear Static and Dynamic Analyses, is the key element for the innovative mechanical development. The mechanical design work is augmented with an in-depth understanding of MIL Standards and special processes.